Packaging of ICs and Chips
Our expertise includes: Fabrication of circuit boards in thin- and thickfilm technology or pcb . The dimensions can be tailored to the specific application, detectors and emitters can include dedicated electronics and amplifiers.
- Precise positioning of detector and emitter chips (selection of chips, dimension/active area, spectral response according demands of application)
- Radiation resistant assembly of optical components (filters, gratings, lenses …)
- Optical passivation of semiconductor chips (partial passivation possible)
- Packaging technology: assembly of chips, bonding, surface mount technology, hermetically sealing/welding of TO-packages with inert gas filling