GTC     |    Sitemap     |    Imprint    |    Data Privacy                    DE     EN

electronic amplifier circuit

Packaging of ICs and Chips

Our expertise includes: Fabrication of circuit boards in thin- and thickfilm technology or pcb . The dimensions can be tailored to the specific application, detectors and emitters can include dedicated electronics and amplifiers.

  • Precise positioning of  detector and emitter chips (selection of chips, dimension/active area, spectral response according demands of application)
  • Radiation resistant assembly of optical components (filters, gratings, lenses …)
  • Optical passivation of semiconductor chips (partial passivation possible)
  • Packaging technology: assembly of chips, bonding, surface mount technology, hermetically sealing/welding of TO-packages with inert gas filling

Please contact us directly or the distributor responsible for your region with your special tasks.